| 摘要 |
1,271,833. Encapsulating electronic devices. HITACHI Ltd. 9 July, 1969 [10 July, 1968], No. 34533/69. Heading B5A. [Also in Division H1] In the manufacture of a semi-conductor integrated circuit device, wherein a semiconductor pellet (not shown) located on a part 15 of a lead frame 3 is encapsulated by plastics e.g. epoxy resin hardened by amine and anhydride hardener, injected in a transfer moulding operation, via a sprue 8, into an encapsulating cavity 9 defined between a two part mould, leakage of resin from the sprue 8 around the clearance 10 between the edge of the frame 3 and a bounding wall of a mould part recess 5, within which is located the frame 3, is prevented by locating a projecting and/or recessed part e.g. 11 or 13, of the frame side edge within a bounding edge of the recess 5 of complementary shape, so that the projecting and/or recessed part is urged by the injection pressure into abutment with the boundary edge to close the gap 10. In the described embodiment, the lead frame 3 is stamped from cobalt sheet of 0.25�0.02 m.m. thickness, to electrode lead parts 16, 17, 18 and 19 whereof a gold plated semi-conductor pellet on the part 15 is connected by gold plated thin metallic wires. |
