发明名称 SOLDER SUCKING DEVICE
摘要 PURPOSE:To effectively complete the melting and sucking of solder by connecting a nozzle part to the tip of a heater cover via a flexible connecting means in a state where the nozzle is held in contact with a heater part. CONSTITUTION:The nozzle 13 is provided at the tip end of the heater part 11. The nozzle 13 is connected to the heater cover 12 via a spring 14 which is fixed at the end of the heater cover 12. In the inside of the nozzle 13, a sleeve 15 and a first connecting member 16 are fit, and the inside is connected to a second connecting member 17 via a spring 18 and is in contact with a inner pipe 10. The inner pipe 10 is connected to a vacuum tank. When the nozzle 13 is pressed against a defectively soldered part, the nozzle is bent at the connecting part and seated along the soldered surface. The seated area of the tip end of the nozzle 13 on the soldered surface is expanded, and the melting time of solder is reduced. As a sucking force is actuated along the soldered surface, the solder is efficiently removed.
申请公布号 JPH05245625(A) 申请公布日期 1993.09.24
申请号 JP19920041543 申请日期 1992.02.27
申请人 AISIN SEIKI CO LTD 发明人 TARA SHIGENOBU
分类号 B23K1/018;B23K101/42;H05K3/34;(IPC1-7):B23K1/018 主分类号 B23K1/018
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