| 摘要 |
PURPOSE:To provide a solder reflowing device by which a good soldering is performed regardless of dimension and heat capacity of the device. CONSTITUTION:In the solder reflowing device provided with a preheating zone 3, reflowing temperature rising zone 4, reflowing zone 5, which are dividedly arranged in order to heat a printed wiring board temporarily attached with surface mounting parts, and a conveyor by which the printed wiring boards are successively transported to each zone; in a section from the reflowing temperature rising zone 4 to the reflowing zone 5, a local heating means 6 is provided by which the local surface of the printed wiring board 7 is heated while being moved in parallel with the conveyor 2. |
