发明名称
摘要 PURPOSE:To provide the subject composition causing no cracks therein, excellent in moisture resistance, soldering heat resistance, long-term reliability and low internal stress, useful for sealing semiconductors etc., comprising a specific epoxy resin, novolak-type phenolic resin, and a specified amount of inorganic filler. CONSTITUTION:The objective composition composed essentially of (A) a glycidyl ether-type epoxy resin having aralkylnaphthol skeleton, (B) a novolak-type phenolic resin, and (C) 25-90wt.%, based on the final composition, of an inorganic filler such as silica powder. The amounts of the components A and B to be used are pref. such as to be 0.1-10 in the molar ratio of the epoxy group of the component A to the phenolic hydroxyl group of the component B. The other objective semiconductor sealing device can be obtained by sealing semiconductor chips with a cured product from the present composition.
申请公布号 JPH05247177(A) 申请公布日期 1993.09.24
申请号 JP19920081702 申请日期 1992.03.03
申请人 TOSHIBA CHEM CORP 发明人 AOKI TOSHIKI;SAWAI KAZUHIRO
分类号 B29C45/02;B29K105/20;B29L31/34;C08G59/00;C08G59/20;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/20 主分类号 B29C45/02
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