摘要 |
PURPOSE:To provide the subject composition causing no cracks therein, excellent in moisture resistance, soldering heat resistance, long-term reliability and low internal stress, useful for sealing semiconductors etc., comprising a specific epoxy resin, novolak-type phenolic resin, and a specified amount of inorganic filler. CONSTITUTION:The objective composition composed essentially of (A) a glycidyl ether-type epoxy resin having aralkylnaphthol skeleton, (B) a novolak-type phenolic resin, and (C) 25-90wt.%, based on the final composition, of an inorganic filler such as silica powder. The amounts of the components A and B to be used are pref. such as to be 0.1-10 in the molar ratio of the epoxy group of the component A to the phenolic hydroxyl group of the component B. The other objective semiconductor sealing device can be obtained by sealing semiconductor chips with a cured product from the present composition. |