METHOD FOR SUPPRESSING TIN PLATING WHISKER

摘要

PURPOSE:To provide the method which can set even a bonding temp. and bonding pressure at ordinary values and can suppress tin plating whiskers at a low cost with high reliability. CONSTITUTION:The inner leads of a film carrier are first subjected to solder plating at 0.05 to 0.4mum thickness then to tin plating in such a manner that the total thickness of the solder plating and tin plating layer attains 0.5 to 1mum at the time of subjecting the above-mentioned inner leads to the tin plating. Then film carrier is then subjected to a heating treatment for 0.5 to 2 hours at 80 to 150 deg.C to adjust the plating thickness to 0.3 to 0.5mum.