| 摘要 |
The invention relates to a portable semiconductor appliance. According to the invention, it comprises an outer container (7), a circuit substrate (2) on which there are electronic parts, the said substrate being accommodated in the said outer container, and a resin (9) capable of forming foam inserted into a space between the outer container and the electronic parts and the substrate, the resin foaming in order to form a component with a predetermined strength. The invention applies especially to integrated-circuit cards. <IMAGE>
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