Installation for wave soldering printed circuit boards - includes transport facility having an adjustable angle of inclination

摘要

Appts. for wave soldering of printed circuit boards with surface mounted devices consists of a housing (1a, 1b, 1c) and a transport facility (11) for conveying printed circuit boards through the housing and, in particular, through a soldering station with one or more solder waves (4) and a solder bath (5). The housing section (1b) over the solder bath (5) is firmly fixed in position, while the transport facility (11) is not firmly attached to the housing section (1b). The entry section (1a) and/or the exit section (1c) together with the transport facility (11) are/is movable (in partic. vertically) so that the printed circuit boards conveyed by the transport facility have different angles of inclination within the region of the solder bath. USE/ADVANTAGE - For mfr. of electronic devices. In comparison with known installations, it is constructionally simpler and is less expensive to implement.