VERFAHREN ZUR VORBEREITUNG VON POLYMEROBERFLAECHEN FUER EINE NACHFOLGENDE PLATTIERUNG, UND DARAUS HERGESTELLTE METALLPLATTIERTE KUNSTSTOFFARTIKEL.

摘要

An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.