发明名称 |
Infrared detector devices and their manufacture. |
摘要 |
Compact electrical connections (4) are formed on side-walls (1) of an infrared detector element having a step structure (1 to 3) over which a conductive layer (40) is deposited. Using a directional etching treatment, such as ion milling, the conductive layer (40) is removed from at least the bottom (3) of the step structure but is left lining the side-wall (1) as the connection (4). This permits formation of connections (4 and 44) in compact dense arrays, including plural-wavelength arrays in stacked bodies (10 and 20) on a circuit substrate (30). <IMAGE> <IMAGE> |
申请公布号 |
EP0561615(A2) |
申请公布日期 |
1993.09.22 |
申请号 |
EP19930301994 |
申请日期 |
1993.03.16 |
申请人 |
PHILIPS ELECTRONICS UK LIMITED |
发明人 |
MATTHEWS, BRIAN EDWARD;JENNER, MICHAEL DAVID |
分类号 |
G01J1/02;H01L27/144;H01L27/146;H01L31/0224;H01L31/10;H01L31/11;H01L31/18 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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