| 摘要 |
A microwave assembly having molded thermoplastic components that are first assembled into a enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhesive cures. After bonding, the waveguide assembly has its critical stage surfaces finish machined prior to plating. <IMAGE> |
