| 摘要 |
PURPOSE:To obtain a plastic molded piezoelectric oscillator of a flat package type having leads or terminals. CONSTITUTION:An IC chip 2 is mounted on an island part 1, and a crystal resonator 5 is fixed on the surface facing the mounting surface of the chip 2. The injection port 9 of a resin package is arranged on a diagonal line. A cylindrical case 7 of the crystal resonator 5 is positioned in the range of + or -45 deg. to the injection port direction. Fixing parts to lead terminals 3 of the crystal resonator 5 and pads of the IC chip 2 are positioned in the diagonal line direction. The piezoelectric oscillator is packaged with resin. |
