发明名称 Semiconductor device
摘要 A semiconductor device. A depression is formed in an insulating portion of a substrate and an electric lead is formed in the depression so that at least a portion of the electric lead is buried in the substrate. A semiconductor device is formed on the substrate and connected to the electric lead. The electric lead may be an extension of a source electrode, a drain electrode, or a gate electrode of the semiconductor device. Also, a gate electrode, a source electrode, or a drain electrode may be buried in a substrate.
申请公布号 US5247191(A) 申请公布日期 1993.09.21
申请号 US19910739333 申请日期 1991.08.01
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI, SHUNPEI;MASE, AKIRA
分类号 G02F1/136;G02F1/1362;G02F1/1368;H01L21/3205;H01L21/74;H01L21/768;H01L23/48;H01L23/52;H01L23/522;H01L27/12;H01L29/78;H01L29/786 主分类号 G02F1/136
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