| 摘要 |
<p>PURPOSE:To reduce the number of components as well as to obtain a package of simplified structure by a method wherein the package is provided with electronic components connected and mounted to and on the thin film conductor layers of a circuit board, which is formed with the thin film conductor layers and has a silicon base body, and lead parts for input/output use brazed to the thin film conductor layers. CONSTITUTION:A circuit board 22 is constituted of a silicon base material 23, a silicon oxide film 24 applied on the surface of the base material 23 and a plurality of thin film conductor layers 25, which are formed on the surface of the film 24 and function as the connection part of a wiring with an LSI chip and the brazed parts of the LSI chip to lead parts for input/output use. Moreover, pins 28 for input/output use, which are used as the lead parts for input/output use, are brazed to the prescribed sites other than the connection part and the brazed parts of the layers 25 via a brazing metal 29. According to this package, as a wire bonding for connecting the lead parts for input/output use to the board 22 is not performed, a reduction in the various reliabilities of the package due to the wire bonding is avoided.</p> |
