| 摘要 |
PURPOSE:To protect a lead and hold a stress-releasing effect at a bending part thereof, by forming a solder dam on the lead so that the bending part is not stiffly soldered by creeping-up solder in a mounting step for a film carrier-type semiconductor device. CONSTITUTION:A solder dam 16b is formed on an OLB lead 14b in a film carrier-type semiconductor device to prevent solder 20b creeping up along the lead. Consequently, the life of a lead until a breaking point can be extended two to four times that of the conventional one in a thermal shock test, such as a heat cycle test. |
