Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
申请公布号
US5245751(A)
申请公布日期
1993.09.21
申请号
US19910782608
申请日期
1991.10.25
申请人
CIRCUIT COMPONENTS, INCORPORATED
发明人
LOCKE, BARBARA E.;BURDICK, LYNN E.;OWENS, MARK J.;ST. LAWRENCE, MICHAEL;SIMPSON, SCOTT S.