发明名称 Array connector
摘要 Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
申请公布号 US5245751(A) 申请公布日期 1993.09.21
申请号 US19910782608 申请日期 1991.10.25
申请人 CIRCUIT COMPONENTS, INCORPORATED 发明人 LOCKE, BARBARA E.;BURDICK, LYNN E.;OWENS, MARK J.;ST. LAWRENCE, MICHAEL;SIMPSON, SCOTT S.
分类号 B23K26/38;H01L21/48;H01L23/498;H01R13/22;H05K3/42 主分类号 B23K26/38
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