| 摘要 |
<p>PURPOSE:To ensure a printed board wiring region around parts of a high level integration LSI, keep the efficiency of wiring design equal to that of a conventional parts, and restrain enlargement of parts size. CONSTITUTION:A lead pin 13a for connection consists of an L-shaped surface mount lead pin 13 for connection and a J-shaped surface mount lead pin 13a for connection which protrude from the side surface of a part main body 1, and is connected to a reflow pattern 12 formed on the surface of a printed board by using solder or the like.</p> |
