发明名称 |
DIE BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME |
摘要 |
A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die. |
申请公布号 |
US5246513(A) |
申请公布日期 |
1993.09.21 |
申请号 |
US19910763214 |
申请日期 |
1991.09.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIDA, MASAHARU;BANJO, TOSHINOBU;YAMAMOTO, AKIRA |
分类号 |
H01L21/52;H01L21/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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