发明名称 LEAD FRAME FOR RESIN MOLD AND RESIN MOLDING APPARATUS
摘要 PURPOSE:To provide a lead frame for resin mold and a resin molding apparatus which can easily inspect a state of filled fused resin for molding a heat radiating plate or the like. CONSTITUTION:An elastic piece 34 which deforms according to fluid characteristics of fused resin 51 is connected to extended tie bars 31a, 31b at an end of a lead frame 30a for resin molding. The lead frame 30a clamps the elastic piece 34 between upper and lower metal molds 11,12 with a monitoring cavity 17 formed for injecting resin to approximately same thickness as the lead frame 30a.
申请公布号 JPH05243358(A) 申请公布日期 1993.09.21
申请号 JP19920040841 申请日期 1992.02.27
申请人 NEC KANSAI LTD 发明人 KANAMAKI MASAYUKI
分类号 H01L21/56;H01L21/66;H01L23/28;(IPC1-7):H01L21/66 主分类号 H01L21/56
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