发明名称 METHOD OF CONNECTING SIGNAL OF MULTILAYER PRINTED WIRING BOARD
摘要 <p>PURPOSE:To connect the pattern wiring of a multilayer printed wiring board with the lead pin of an electronic part without using solder. CONSTITUTION:A cylindrical metallic socket 4, whose one end is blocked, is press-fit in the through hole of a multilayer printed wiring board 3, and pattern wirings 5 and 7 and the socket 4 are electrically connected. Next, the lead pins 1a and 2a of an electronic part are inserted into this socket 4, and the socket 4 and the lead pins 1a and 2a are electrically connected.</p>
申请公布号 JPH05243743(A) 申请公布日期 1993.09.21
申请号 JP19920043955 申请日期 1992.02.28
申请人 NEC CORP 发明人 WATANABE HIDEO
分类号 H01R4/18;H05K1/00;H05K1/11;H05K1/18;H05K3/30;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01R4/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利