| 摘要 |
<p>PURPOSE:To solve problems of not only no normal burn-in test but also damage of a semiconductor device due to an increase in a thermal resistance when dusts exist between the device and a heat sink to deteriorate its contact. CONSTITUTION:A semiconductor device 2 is brought into contact with heat transfer device 4, and heat generated in the device 2 is transferred to a heat sink 1. The substance 4 is inserted before a burn-in test thereby to prevent a remarkable increase in the thermal resistance.</p> |
