发明名称 |
CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE:To facilitate the checking in the manufacturing process to increase the workability and mount many control parts, by separately mounting semiconductor chips and control parts on the copper circuits of the same metallic board. CONSTITUTION:Semiconductor chips 4 are mounted on a copper circuit 3a disposed on an insulating layer 2 of a metallic board 1, a printed-circuit board 7 having openings 10 preformed thereon and many control parts 8 mounted on the surface thereof is attached to a copper circuit 3b, and the printed-circuit board 7 is short-circuited with the copper circuit 3b immediately under the openings 10.</p> |
申请公布号 |
JPH05243704(A) |
申请公布日期 |
1993.09.21 |
申请号 |
JP19920081513 |
申请日期 |
1992.03.02 |
申请人 |
SANSHA ELECTRIC MFG CO LTD |
发明人 |
YASUDA TOYOJI;OKAMOTO SHIGERU;TOKUDA TOSHIHIDE;KOMURO YOSHIAKI |
分类号 |
H01L21/60;H05K1/14;H05K1/18;(IPC1-7):H05K1/14 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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