| 摘要 |
<p>PURPOSE:To decrease the height of a loop part of a wire, by displaying each tip part of the inner leads. CONSTITUTION:A die pad 12 is bent and displayed at the shaded parts of both suspensions. The tip part 13a of each inner lead 13 is bent and displayed at the shaded part 13b, and lowered as compared with the other part 13c of the inner lead 13. The depth of display of each tip part 13a of the inner leads 13 is set in the manner in which the upper surface of the tip part 13a die-bonds an IC chip 5 to the displayed die pad 12. Since the bonding surface of the tip part 13a of the inner lead 13 is made lower than the other part 13c by displaying, a wire 7 can be pulled downward at the time of wire bonding. Thereby the height of a loop part 7a of the wire 7 can be decreased.</p> |
