| 摘要 |
PURPOSE:To realize appropriate contact with conductive pads arranged in high density in a lower surface of a leadless type IC while making contact embedding density of a connector highly dense, and enable no-load mounting of this IC on a leadless type IC connector. CONSTITUTION:A spring strip piece 3 standingly embedded in a contact retaining part 4 is bending-displaced by lateral movement of a contact operating part 6. Due to this bending-displacement, a tip 12 of the spring strip piece 3 is braked and expanded/contracted by a through hole 11 provided on a contact braking part 5, and because of this expansion, pressurizing contact of a leadless type IC opposingly arranged in the through hole 11 with a conductive pad is realized. |
