发明名称 |
SEMICONDUCTOR WAFER PROCESSING SYSTEM |
摘要 |
A semiconductor wafer processing system having a plurality of processing devices forming a base processing line for processing in sequence a workpiece having a semiconductor wafer is provided with an auxiliary loader connected to one of the processing devices for supplying the workpiece forming a processing line different from the base processing line, and an auxiliary unloader connected to the one processing device for receiving the workpiece processed by the one processing device at times when the one processing device is not supplied the workpiece by the processing device upstream of the one processing device in the base processing line.
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申请公布号 |
US5246524(A) |
申请公布日期 |
1993.09.21 |
申请号 |
US19890349542 |
申请日期 |
1989.05.09 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
KURODA, SHIGEJI;SEKIDO, TOSHIYUKI;NODA, KAZUHIRO;KINBARA, MATSURO |
分类号 |
B23Q7/04;B23Q7/10;B28D5/00;H01L21/00;H01L21/301;H01L21/677 |
主分类号 |
B23Q7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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