| 摘要 |
A low temperature IC handling apparatus having premeasurement and postmeasurement drying chambers 3 and 4 which are provided at entrance and/or exit of a low temperature IC test chamber 1 and connected therewith via shutters 6 and 7, respectively. The drying chambers 3 and 4 are provided with low humidity nitrogen gas supply units 9 and 11, respectively, and a mechanism 13 for supplying an IC 17b to be measured to the low temperature IC test chamber 1 and a mechanism 14 for unloading a measured IC 17c from the low temperature IC test chamber 1, respectively. A control unit for controlling these mechanisms is provided. Frosting on the seam between the low temperature IC test chamber and the drying chambers and on movable components in these chambers can be prevented and dew condensation on ICs after completion of the measurement at fixed low temperature can be prevented. Therefore, operating efficiency can be considerably increased.
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