| 摘要 |
<p>PURPOSE:To prevent the Manhattan phenomenon when chip-like electronic parts for surface mounting are soldered. CONSTITUTION:On the end surface and the peripheral surface of the end section of a chip-like electronic parts, a metallic layer 2 wet with solder, which is easy to be wet with solder, is formed. On a section of the metallic layer 2 wet with solder, which exists on the end surface, a metallic layer 3 unwet with solder, which is hard to be wet with solder, is formed. Thus, the terminal electrode of the chip-like electronic parts, which comprises the metallic layers 2, 3, is formed. Thereby, since the fused solder does not wet the metallic layer 3 and is not stuck on it, the end surface of the chip-like electronic parts in not stretched by the solder, and the Manhattan phenomenon can be prevented.</p> |
