发明名称 Heat-resistant hermetic packages for electronic components
摘要 A heat-resistant package for electrical components comprises a housing composed of a plurality of independent side walls made of heat resistant ceramic material. Sealed-in leads are provided in one or more of the side walls. After, the leads are installed the ends of the side walls are brazed together to form a closed ring and that ring is brazed to the housing bottom wall. Also, a continuous metal ring may be brazed to the tops of the side walls. The brazings provide hermetic seals between the housing walls and they, along with the seal ring, provide compliance between the walls making the housing resistant to thermal shocks.
申请公布号 US5247134(A) 申请公布日期 1993.09.21
申请号 US19910748027 申请日期 1991.08.21
申请人 FRENCHTOWN CERAMICS, CO. 发明人 BELTZ, KENNETH A.
分类号 H01L21/50;H01L23/057 主分类号 H01L21/50
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