发明名称 METHOD OF FORMING SEMICONDUCTOR HETEROJUNCTION
摘要 PURPOSE:To improve element characteristics by heating a silicon substrate under an ultra-high vacuum and exposing the clean surface and obtaining the atomatically flat surface of a silicon. CONSTITUTION:In a method of forming a semiconductor heterojunction, a silicon substrate 10 is heated under an ultra-high vacuum and the clean surface is exposed, and the atomatically flat clean surface 12 is obtained. Then, a natural oxide film 16 is grown n the clean surface 12. Or, free bonds of the clean surface 12 of a silicon are terminated with a monovalent atom such as hydrogen so as not to rearrange surface atoms and the clean surface 12 of the silicon is passivated. Then, the atomatically flat interface is obtained by forming another substance by methods such as adsorption or deposition. Accordingly, an interface scattering of transit electrons or an electrical breakdown can be reduced.
申请公布号 JPH05243266(A) 申请公布日期 1993.09.21
申请号 JP19920334205 申请日期 1992.12.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NIWA MASAAKI;HIRAI YOSHIHIKO;YASUI JURO;UDAGAWA SHOJI
分类号 H01L27/04;H01L21/02;H01L21/30;H01L21/302;H01L21/306;H01L21/336;H01L21/822;H01L29/04;H01L29/06;H01L29/12;H01L29/78;(IPC1-7):H01L21/336;H01L29/784 主分类号 H01L27/04
代理机构 代理人
主权项
地址