WIRING STRUCTURAL BODY OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF,申请号JP19910081176-传众专利搜索

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发明名称	WIRING STRUCTURAL BODY OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要
申请公布号	JPH05243404(A)	申请公布日期	1993.09.21
申请号	JP19910081176	申请日期	1991.03.22
申请人	NEC CORP	发明人	HAYAMA NOBUYUKI
分类号	H01L21/3205;H01L21/768;H01L23/522;(IPC1-7):H01L21/90;H01L21/320	主分类号	H01L21/3205
代理机构		代理人
主权项
地址

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