| 摘要 |
PURPOSE:To prevent the occurrence of defect in connection between a connection point and a contact pin by putting the difference of film thickness of the contact ring of each layer below the limit of the elastic deformation of the conductor of the connection Pin. CONSTITUTION:Many parallel inner layer patterns 2 are stacked, with their directions changed 90 deg. for every layer, and also surface copper layers 3 are stacked on both surfaces. Then, a through hole 4 is opened, and copper plated layers 5 are made on the inside peripheral surface of the through hole 4 and the surface copper layers 3 on both sides. Then, a differential point hole 6 is made at each differential point. Then, a contact ring 7 is made at the copper- plated layer 7n by electric plating. Then, resist patterns 8 are made on both surfaces of a matrix board 1, and then nickel/gold-plated layers 9n are made in the necessary parts on both surfaces of the matrix board 1, at the inside peripheral face of the through hole 4, and the copper plated layer 7n inside the differential point 6. Lastly, with the nickel/gold plated layer 9n as a mask, needless copper plated layer 7n and the surface copper layer 3, and the panel copper plated layer 5 are removed by etching. |
