| 摘要 |
PURPOSE:To enable the title adapter to suite to ICs having various shapes by forming a framework for housing an IC element by connecting a plurality of side face members having sizes meeting the size of the IC element. CONSTITUTION:The title adapter 10 is provided with a substrate 12, conductive elements 14, and a plurality of side face members 18, 20, 22, and 24 which are connected to each other for forming a framework 16 and conductive pads 13 are formed on the substrate 12. The pads 13 are connected to the elements 14 which are electrically brought into contact with the leads of an IC when the adapter 10 is mounted on the IC and the framework 16 is constituted of the members 18, 20, 22, and 24 and has a cavity 32 for housing the IC. A side wall 28 has a rib 34 extended into the cavity 32 and fixes the side face of the IC like a cantilever. Then contacts 58 for testing are electrically connected to the conductive contact pads 13 on the rear surface.
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