| 摘要 |
PURPOSE:To increase packaging density and cope with multielectrode configuration by reducing the occupied area of a semiconductor device. CONSTITUTION:An insulating substrate 8 wherein a circuit is formed by using conductor 7 is stuck or fused on a semiconductor element 1, and electrodes 4 on the semiconductor element 1 are connected with the conductor 7 on the insulating substrate 8 by using metal thin wires 5. A part or the whole part of the conductor 7 of the structure body is exposed, and the structure body is sealed with resin 6. Thereby the occupied area of a semiconductor device is reduced and the packaging density can be increased. Further, fine working of the conductor 7 is enabled, and a multielectrode configuration can be realized.
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