| 摘要 |
PURPOSE:To prevent a resin in a sub-runner from remaining on a sealed resin body or prevent a part of the sealed resin body from being chipped in a process for removing the resin in the sub-runner from a package after the resin is sealed. CONSTITUTION:A resin fed under pressure through a main runner 3 and a sub-runner 4 of a transfer molding mold loaded with a lead frame 8 is injected into a cavity 1 from a gate 7. When the resin is fully charged into the cavity l and an injection pressure reaches a predetermined value, an ejector pin 2 is immediately actuated to close the gate 7. In this manner, a sealed resin body 9 in the cavity 1 is separated from a resin in the sub-runner 4. |
