| 摘要 |
<p>A plurality of multi-chip modules (202) are stacked and bonded around the perimeter by sold-bump bonds (46) to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules (202) comprise a circuit board (11) having a planarized interconnect structure formed on a first major surface, and integrated circuit chips (10) bonded to the planarized interconnect surface. Around the periphery of each circuit board (11) long, narrow 'dummy chips' are bonded to the finished circuit board to form a perimeter wall (200). The wall is higher than any of the chips (10) on the circuit board (11) so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall (202) in the same way and at the same time that chip to board interconnect may be laser-patterned.</p> |
