COATING METHOD OF PHOTO RESIST

摘要

The method increases or decreases the RPM of the spinner by times to adjust the coating uniformity and the coating thickness. To coat photo resist in a curved pattern following the stepped first and second patterns on the wafer, the spinner RPM is increased to a scheduled 2nd stage RPM to be maintained for a scheduled time during which to RPM is increased to the prearranged 3rd stage for 1-2 sec. and return to the 2nd stage RPM for maintaining.