| 摘要 |
<p>Microchannel cooling is applied to flip-chip bonded integrated circuits (30) in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips (125). The technique is suited to either multichip integrated circuit boards (120) in a plane, or to stacks of circuit boards (120) in a three dimensional interconnect structure. Integrated circuit chips (125) are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold (31) delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer (130) is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip (125) and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.</p> |
