发明名称 |
Mechanically enhanced, high impact strength triazine resins, and method of preparing same. |
摘要 |
<p>Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite. <IMAGE></p> |
申请公布号 |
EP0560084(A2) |
申请公布日期 |
1993.09.15 |
申请号 |
EP19930102335 |
申请日期 |
1993.02.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MEHTA, ASHID ARVIND;NIU, TYAN MIN;SPRINGER, LEE PAUL;SUMMA, WILLIAM JOSEPH;WILDING, LEE PALFREY |
分类号 |
C08L27/12;C08L79/04;H01L21/48;H01L23/14;H05K1/03 |
主分类号 |
C08L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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