发明名称 |
ELECTRONIC DEVICE SEALING RESIN COMPOSITIONS AND SEALED ELECTRONIC DEVICES |
摘要 |
<p>Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt.% of a poly(arylene thioether-ketone) and 0-90 wt.% of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.</p> |
申请公布号 |
EP0369652(B1) |
申请公布日期 |
1993.09.15 |
申请号 |
EP19890311402 |
申请日期 |
1989.11.03 |
申请人 |
KUREHA KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
KOUYAMA, TOSHITAKA;SUZUKI, KEIICHIRO;ENOKI, TOSHIO;SAKAGUCHI, YASUO |
分类号 |
C08L81/02;C09K3/10;H01B3/30;H01L23/29;H01L23/31 |
主分类号 |
C08L81/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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