Method of making contact surface for contact element

摘要

A miniature socket (10) for electrically interconnecting contact pads on a bare integrated circuit chip (16) to circuit pads (64) on a substrate (18) is disclosed. The socket includes a housing (12) and contact elements (14) having a diameter of about 0.003 inches. The housing (12) includes a recess (28) on one surface (30) for receiving the circuit chip (16) and cavities (44) on an opposite surface (38) for receiving the contact elements (14) and passages (56) leading to the recess (28) from the cavities (44) for receiving the pin sections (80) on the elements (14). Methods of forming a gold tip (84) on the pin sections (80) and for providing cavities (44) and passages (56) in the housing (12) are also disclosed.