| 摘要 |
The invention provides increased surface contact area for circuit board heat removal, without exposing the circuit board components to the coolant fluid. This is accomplished by compressing a heat conductive flexible membrane between adjacent circuit boards. The flexible membrane contains coolant fluid which is pumped into and out of the flexible membrane. The membrane isolates the circuit board components from the coolant fluid and is flexible enough so that it conforms to the surface of individual circuit boards. A plurality of coolant membranes are sandwiched between adjacent circuit boards and housed such that the combination of fluid pressure and circuit board to circuit board spacing maintain the conformity of the membrane to the circuit board surface. Individual circuit boards within the housing are electrically connected with edge connectors on all four sides and are separately removable from the housing. Fluid flow to coolant membranes is maintained through the edges of the membranes and between the circuit boards at the four corners of the circuit boards. This lamination of cooling membranes between circuit boards, each with their individual edge electrical connections and cooling connections, allows efficient packaging of the electrical components on the circuit boards.
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