Plasma deposition of fluorocarbon

摘要

Polymeric fluorocarbon layer is prepared by plasma enhanced chemical vapor deposition in a chamber, the walls of which are coated with a polymeric fluorocarbon film by introducing a gaseous polymerizable fluorocarbon into the chamber and applying radio-frequency at a power level of about 100 to about 1000 watts, employing a pressure of about 10 to 180 mTorr and a self-bias voltage of about -50 to about -700 volts. The polymeric fluorocarbon layer is about 0.05 to about 5 mu m thick, has a maximum dielectric constant of about 2.5, has a C/F ratio of about 1:1 to about 1:3, is thermally stable at temperatures of at least about 350 DEG C., and is substantially free from metallic contamination and oxygen.