Adhesive bond degradation monitor

摘要

A method and apparatus for detecting changes in the structural strength of a bonded joint. Changes in one or more dielectric properties of the bonding adhesive, such as resistance and capacitance, are monitored by a microdielectrometer. A change in a bond dielectric measurement is indicative of a moisture intrusion in the bond and a corresponding weakening of the structural integrity of the bond. A warning or indication of the bond degradation is provided in response to such changes.