| 摘要 |
PURPOSE:To reduce in size a power source by performing excellent heat dissipation of a heat generating component for constituting the power source. CONSTITUTION:Resistors R1 to R3 for constituting an absorber circuit of a heat generating component for generating heat of largest quantity are formed in chip state, and mounted on a thermal conductive circuit board 6. On the other hand, other heat generating components are mounted on a thermal conductive member 3. Heats on a thermal conductive wiring 6 and a thermal conductive member 3 are dissipated to a heat dissipating unit 1 through a thermal conductive sheet 2. Thus, air wiring of the resistors R1 to R3 is eliminated, and heats of the heat generating components can be efficiently dissipated. |
