WIRING FORMING METHOD FOR SEMICONDUCTOR DEVICE,申请号JP19920056595-传众专利搜索

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发明名称	WIRING FORMING METHOD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH05234939(A)	申请公布日期	1993.09.10
申请号	JP19920056595	申请日期	1992.02.10
申请人	SONY CORP	发明人	KANEMURA RYUICHI
分类号	H01L21/203;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):H01L21/285;H01L21/320	主分类号	H01L21/203
代理机构		代理人
主权项
地址

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