| 摘要 |
<p>PURPOSE:To prevent a bonding pad from spreading sideways due to an external force applied at bonding so as to enhance the bonding of a lead wire to the bonding pad in strength. CONSTITUTION:An insulating film 2 is formed on a P-type semiconductor substrate 1, and then a conductive film 3 provided with an opening 4 is formed thereon. Then, interlayer insulating films 5 and 6 are formed, and then a bonding pad 7 is provided through a gold plating method. At this point, a recess (groove) 8 of 5mum or so width is formed inside the opening 4. Lastly, a protective film of polyimide is formed. By this setup, distortions of the bonding pad 7 caused by an external pressure at bonding concentrate on the recess 8. The bonding pad 7 is deformed inwardly, centering on the recess 8, so that it hardly spreads sideways.</p> |
