| 摘要 |
PURPOSE:To easily switch an insert, an emulator and a microcomputer by providing the first part which consists of a terminal B connected with a terminal A in the same array as the packaging pattern of a printed substrate; and the second part which consists of a terminal D connected with a terminal C connectable with the packaged IC, to which the terminals D and B can be pressure-connected. CONSTITUTION:The first part is composed of a terminal 11 in the array the same as the packaging pattern on a printed substrate for surface packaging, and the terminal 12 which can connect with the terminal 11 through a wiring 18. The second part is composed of a terminal 13 which can connect with an IC packaged on a substrate, and a terminal 14 connecting with the terminal 13 through wirings 16, 19, and 17, and the wiring 19 is formed on the printed substrate 15. The wiring 18 is formed of an elastic material, the terminals 12 and 14 are pressure-connected, and an IC socket 10 is composed of the first and the second parts. As a result, an insert, an emulator and a surface mount microcomputer can be connected easily. |
