| 摘要 |
PURPOSE:To protect a bonding pad against corrosion caused by moisture penetrating from outside by a method wherein a dummy pad is arranged around a bonding pad smaller than a bonding ball. CONSTITUTION:An inner wiring 6 is connected to a bonding pad 3, where the bonding pad 3 and a dummy pad 3a are separated from each other by a certain distance so as not to come into contact with each other when the pad 3 and the dummy pad 3a are crashed by a bonding ball 5 which is bonded by pressure at wire bonding. That is, the bonding pad 3 is set smaller than the ball 5 formed at the tip of a bonding wire. The dummy pad 3a is provided around the bonding pad 3 as separated from each other. By this setup, the exposed part of the bonding pad 3 is protected against corrosion due to moisture penetrating from outside to cause imperfect connection. |
