| 摘要 |
<p>PURPOSE:To reduce the capacitance of an electronic circuit by a constitution wherein a test is conducted by bringing a probe needle into contact with a prescribed part on a semiconductor chip on the surface of a semiconductor wafer under test. CONSTITUTION:A semiconductor wafer 27 is held on the rear of a stage 26. The stage is moved to the X-axis direction and the Y-axis direction by means of an X-Y driving pulse motor. The semiconductor wafer 27 is situated directly above a probe card 34; after that, the stage 26 is lowered by means of a Z driving motor; the tip of a probe needle 37 is brought into contact with a prescribed bonding pad 38 on a semiconductor chip 28 under a preset needle pressure. The electric characteristic of the semiconductor chip 28 is measured by means of a tester program and a measuring circuit which have been built in a tester main-body part 21 and a tester head 23. Since a part between the semiconductor chip 28 and the measuring circuit is connected by using a very short electric circuit without the intermediary of an internal interconnection or the like, the electrostatic capacity of the electric circuit can be reduced.</p> |
