| 摘要 |
PURPOSE:To obtain a glass ceramic multilayer circuit board having high reliability without impairing signal transmission characteristics by plating a surface of a low permittivity glass ceramic multilayer circuit board and preventing a crack that used to generate when I/O pins are brazed. CONSTITUTION:After two types of green sheets having different specific permittivities obtained by a doctor blade method are metallized by a screen printing method, a low permittivity ceramic layer 1 is laminated on an inner layer, and high permittivity ceramic layers 4 each having relatively high mechanical strength are laminated on both front and rear outer layers of a board and baked to be formed in a sandwich structure. |
