| 摘要 |
PURPOSE:To obtain the material for forming epoxy resin for sealing with which a mold trouble such as unsuccessful filling does not occur even in a small-size thin semiconductor package by making the grain size of the formation material smaller than the predetermined value. CONSTITUTION:As for epoxy resin, bisphenol A, novolak-type epoxy resin or other material is used. And, phenol resin, melamine resin or other material is used for a bridging agent and a hardening agent. For a hardening accelerator which is used as occasion arises, phosphorus and/or tertiary amine hardening accelerator is used. It is preferable that an inorganic filler of the grain size smaller than 200 mesh is used. If necessary, a coupling agent, etc., can be added. These materials are blended, mixed, kneaded and ground. The grain size of the ground material should be smaller than 100 mesh. When the grain size exceeds 100 mesh, the material should be finely ground again and is pelletized if necessary and thereby the material for forming epoxy resin for sealing is obtained. |
